RHTEC Split Type Co2 Laser Marking and Engraving Machine
RH-C Co2 laser marking and engraving machine adopts the industrial standardization module design. RF series are fitted with full set of imported metal sealed radiation frequency Co2 laser, and equipped with high speed scanning galvanometer and extending focusing system.
The machine also has high stability and anti-intervention industrial computer system as well as high precise lifting platform. It can work on a continuous 24 working hours in high stability, high precision, and high speed.


Application
1. Packaging industry
Medicine/food packaging: Mark the production date, batch number and anti-counterfeiting code on plastic and paper packaging, which meets hygiene standards and is free of chemical pollution.
Beverage bottle cap/cosmetic packaging: High-speed marking realizes personalized identification to meet the needs of mass production.
2. Light industry manufacturing
Leather/textile: Carve patterns or brand LOGO on the surface of bags, shoes and clothing to maintain the original texture of the material.
Bamboo and wood crafts: Finely engraved text and patterns, suitable for gifts, furniture decoration and other fields.
3. Electronics and precision devices
Plastic/rubber components: Mark serial numbers and specifications to ensure that information is permanently clear.
PCB/electronic components: Non-contact processing to avoid material damage.
4. Other industries
Architectural ceramics: Engrave codes or decorative patterns on the surface of tiles.
Advertising logos: Hollow cutting and graphic engraving of acrylic and PVC sheets.
Advantages:
High precision: The laser beam is focused to a micron-level spot, suitable for complex graphics processing.
Environmentally friendly and efficient: No consumables, low energy consumption, ROHS compliant.
Convenient operation: Supports automatic coding, serial number increment, and reduces manual intervention.
Durability: The laser tube has a life of 45,000 hours and supports 24-hour continuous operation.
Model | RH-PC |
Laser Power | RF 10W/30W |
Processing Area | 110*110-200*200mm |
Wavelength | 10600nm |
Beam Quality | <1.4M2 |
Marking Speed | <10000MM/S |
Marking Depth | ≤2MM |
Repetition Precision | ±0.01MM |
Min. Line Width | 0.02MM |
Min. Character | 0.2MM |
Cooling Mode | Air Cooling |
Graphic Formats Supported | PLT, DST, AI, DXF, BMP, JPG, CAD, CDR, DWG |
Power Source | AC 110/220V, 50/60Hz |
Working Temperature | 10-35 temperature |
Working Humidity | <75%(No condensation) |
Working Environment | Clean, free of dust |
Gross Power | < 1250W |







